Shin-Etsu Chemical liquid epoxy encapsulating material (SMC series) is a one component type liquid epoxy materials which developed on the basis of semiconductor devices for especially underfill applications.
Semiconductor devices molded by "SMC" have excellent electrical characteristics and moisture resistance. In addition, it is shown outstanding function on stress reduction by using specific technique of silicone.

Properties

Capillary Underfill

Product	Filler cut size	Melt viscosity	Tg	CTEα1	Flexural modulus
	μm	Pa*s	°C	ppm	GPa
SMC-377S	10	30	100	35	8
SMC-3700UF	5	14	120	27	8
SMC-375TGSF5	1	9	115	35	7
SMC-375TGSF11	1	25	115	28	8

Board Level Underfill

Product	Filler cut size	Melt viscosity	Tg	CTEα1	Flexural modulus
	μm	Pa*s	°C	ppm	GPa
SMC-365SDL	24	3	130	30	7
SMC-365SDL-4	24	5	140	26	8

High thermal Conductive Underfill

Product	Filler cut size	Melt viscosity	Tg	CTEα1	Flexural modulus	Thermal conductivity
	μm	Pa*s	°C	ppm	GPa	W/mK
X-43-5881AL	3	46	113	29	9	2

Dam & Potting

Product	Feature	Sprialflow	Melt viscosity	Tg	CTEα1	Flexural modulus
		cm	Pa*s	°C	ppm	GPa
SMC-762DT	Dam	53	100	145	12	16
SMC-762NN	Potting	53	25	135	13	15

Potting for Power device Module

Product	Melt viscosity	Tg	CTEα1	Flexural modulus	Breakdown Voltage
	Pa*s	°C	ppm	GPa	kV/mm
SMC-8750L	110	150	18	10	30
SMC-8750L2	700	150	11	20	30
SMC-8750K7	65	220	19	12	33
SMC-8750X2	500	180	11	20	30