Shin-Etsu Chemical Co.,Ltd. Organic Electronics Materials Dept.

Low temperature or short time curable

Energy saving at production process

Silicone adhesive
KJC-5080 <R.T~80°C> (2 component silicone)
Molding compound
X-43-2943 <R.T150°C / 90sec>
Coating material
KJR-6501 <R.T185°C / 2hrs>

* The data of each product that exists in the above-mentioned table is not a standard value. Please test without fail before use beforehand, and confirm whether to suit use.