Liquid epoxy encapsulation material
SMC series
SMC series are liquid epoxy encapsulation materials developed for potting materials, adhesives, and underfill materials for semiconductor devices.
The semiconductor device which is protected by this encapsulation material has excellent electrical properties and moisture resistance.
In addition, the low stress properties by using silicone which is Shin-Etsu Chemical's original technology, shows excellent properties in heat resistance.
Properties
Capillary Underfill
| Grade | Recommended design |
Minimum Gap size | Viscosity (25°C) |
Tg (TMA) |
CTE1/CTE2 | Flexural modulus |
Curing Condition |
|---|---|---|---|---|---|---|---|
| μm | Pa*s | °C | ppm/°C | GPa | |||
| SMC-365UF | 2ndary UF | 40 | 3.3 | 130 | 30/120 | 6.5 | 150°C 2hrs |
| SMC-775UF | 2ndary UF | 100 | 65 | 220 | 19/72 | 12 | 165°C 2hrs |
| SMC-375UF | CoC/CoW | 20 | 9 | 115 | 35/115 | 6.5 | |
| SMC-375UFA | FC-BGA | 20 | 25 | 115 | 28/100 | 8.0 |
Sidefill,Adhesive
| Grade | Feature | Viscosity (25°C) |
Thixotropic index |
Tg (TMA) |
CTE1/CTE2 | Flexural modulus |
TC | Volume resistivity |
Curing Condition |
|---|---|---|---|---|---|---|---|---|---|
| Pa*s | - | °C | ppm/°C | GPa | W/mK | Ω・cm | |||
| SMC-365S | Sidefill | 60 | 2.0 | 120 | 25/100 | 9.5 | - | - | 120°C 1hr |
| SMC-788SG | Thermal conductive |
30 | - | 70 | 45/140 | 7.0 | 3.5 | 3 x 10-4 | 150°C 1hr |
| SMC-850G | Heat resistance | 120 | - | 260 | 12/48 | 17 | - | - | 200°C 3hrs |
Dam,fill material
| Grade | Feature | Viscosity (25°C) |
Thixotropic index | Tg(TMA) | CTE1/CTE2 | Flexural modulus | Curing Condition |
|---|---|---|---|---|---|---|---|
| Pa*s | - | °C | ppm/°C | GPa | |||
| SMC-762P | fill material | 30 | 1.5 | 140 | 13/56 | 15 | 150°C 2hrs |
| SMC-762D | Dam material | 250 | 3.3 | 135 | 16/68 | 12 |
Seal material,Globe top material
| Grade | Feature | Viscosity (25°C) |
Thixotropic index | Tg(TMA) | CTE1/CTE2 | Flexural modulus |
|---|---|---|---|---|---|---|
| Pa*s | - | °C | ppm/°C | GPa | ||
| SMC-762DT | Seal material | 90 | 2.2 | 145 | 12/50 | 16 |
| SMC-762AL-B | Globe top material | 25 | 2.2 | 140 | 23/77 | 11 |
| SMC-762AL-T | Globe top material | 20 | 2.5 | 140 | 19/78 | 11 |
Potting for Power device Module
| Grade | Application | Max. Junction temperature （Tjmax.) |
Thermal Conductivity |
Melt Viscosity |
Tg | CTE1 | Flexural strength |
Flexural modulus |
Tracking resistant |
Cure Condition |
|---|---|---|---|---|---|---|---|---|---|---|
| W/mK | cm | °C | ppm/°C | MPa | GPa | V | ||||
| SMC-8750S | Power device Module Module for Car electronic Motor |
175°C | - | 140 | 200 | 15 | 110 | 14 | > 600 | 165°C 2hrs |
| SMC-8750TC | Power device Module Module for Car electronic Motor |
175°C | 3 | 200 | 200 | 15 | 120 | 19 | > 600 | 165°C 2hrs |
* The data of each product that exists in the above-mentioned table is not a standard value. Please test without fail before use beforehand, and confirm whether to suit use.