Shin-Etsu Chemical Co.,Ltd. Organic Electronics Materials Dept.

Products

Silicone molding compound

Shin-Etsu Chemical is offer silicone molding compound which can be thermosetting transfer molding system for electric and electronic parts. It is contained various fillers and additives based on silicone resin. It has excellent heat resistance, cold resistance and degradation resistance. It is shown stable electrical insulation performance because it is not changing properties by temperature and frequency. In addition, mold releasability is excellent.
Shin-Etsu responds to molding material that requires high heat resistance.

Details of product

Epoxy Encapsulant Material

Shin-Etsu Chemical semiconductor encapsulation materials are epoxy based materials by using transfer molding system for various electronic parts. It is developed with the advanced technology cultivated through the development of silicone. It has excellent low stress, low warpage and high thermal conductivity.
Shin-Etsu supplies not only general surface mount device but also highly reliable encapsulation materials for large automotive power modules and various sensors.

Details of product

Liquid Epoxy Encapsulant Material

Shin-Etsu Chemical liquid epoxy encapsulating material (SMC series) is a one component type liquid epoxy materials which developed on the basis of semiconductor devices for especially underfill applications.
Semiconductor devices molded by "SMC" have excellent electrical characteristics and moisture resistance. In addition, it is shown outstanding function on stress reduction by using specific technique of silicone.

Details of product

Liquid crystal electrode protective silicone resin

Shin-Etsu liquid crystal electrode protective silicone resin is manufactured based on strict process and quality control, and it can shorten the curing time of large-sized liquid crystal panels. Shin-Etsu has various materials from UV curing to room temperature curable type.

Details of product

Polyimide Silicone Coating Material

Shin-Etsu high pressure and heat resistant silicone resin is polyimide silicone for stabilizing the PN junction of diodes and transistors, minimizing leakage current and protecting against mechanical shock and contaminations. It is excellent in heat resistance, electrical characteristics over a wide frequency range, good adhesiveness to various substrates, and effective for improving reliability of devices.

Details of product

High thermal conductive silicone resin

Shin-Etsu high thermal conductive silicone resin is high adhesion, high heat resistance silicone resin which is fully used of silicone resin properties. It can be used for tightening heat sink, improving the reliability and stability of heat generating equipment.

Details of product

Silicone Coating Material

Shin-Etsu silicone coating materials have various properties such as high adhesiveness, improved heat resistance, improved moisture resistance, stress reduction. It plays a major role to show better performance on semiconductor device with protecting electrical.
Shin-Etsu offers various products from gel to rubber, meeting customer requirement.
Silicone coating materials have excellent light resistance (coloring prevention by light) by using of the properties of silicone. It can be used not only for semiconductor applications but also as a protective material for various materials due to thermal stability, high adhesion to inorganic materials.

Details of product

Transparent Silicone / Epoxy Material for LED device

Shin-Etsu Chemical Limpid Si® series is a silicone resin for encapsulation materials, sealing materials for various LEDs (white LED, ultraviolet LED, blue LED). LED devices with less deterioration can be produced by utilizing the characteristics of silicone such as long-term durability, high temperature stability, high adhesion and high refractive index even at high temperature operation due to high brightness of LED.
Coating LED chip used for source of white light, it can be used mix it with phosphor. It is also possible to supply products in film type mixed with phosphor.
Shin-Etsu offers a wide range of products from soft gels to hard types applicable for transfer molding system, and can supply grade suitable for your needs.

Details of product

Silane Gas

Shin-Etsu high purity Silane gas are used for a wide range of applications, including electronics applications such as semiconductor insulation coating and epitaxial coating, optical fibers, and chemical applications such as fine ceramics. With high purity and stable supply supported by advanced refining technology, strict quality control, and container delivery management etc., Shin-Etsu has received a great deal of trust in meeting the diverse requirement of customers.

Details of product

Optical fiber coating material

Optical fiber coating material is protects the surface of very thin optical fiber with a cross section diameter of 125μm and improves strength with excellent in heat resistance, cold resistance, and demonstrates stable function over a wide temperature range.
Besides the heat curing type, there are products of UV curing type corresponding to high speed drawing.

Details of product

High thermal stability and self-adhesive silicone film

High thermal stability and self-adhesive silicone film is an adhesive film material in which silicone resin and phosphor are mixed. By pasting on the LED chip surface, can easily convert the blue emitted LED to light of various colors such as white and show the color to be uniform. It is also excellent in heat resistance and light resistance, and it can be used for a long time.

Details of product

Silicone Board for LED, High Frequency Device etc

Silicone substrate is material that reflects the light from LED and enhances brightness. It is excellent in heat resistance and degradation resistance, contributing to the prolongation of the life of LED illumination. With high process technology, possible to correspond to various package shapes.

Details of product

Die Attach Material

Shin-Etsu die attach materials are two types, epoxy and silicone type. Epoxy based B stage material is a high purity insulating die attach material developed for stencil or screen printing. Showing good performance releasability, shape retention, storage stability at B stage status(semi-cured status with no tack appearance). After chip bonding, it can be re-melted by heating at high temperature and treat like thermal curing. It shows high low stress after curing.

Details of product

Die Attach Material

Shin-Etsu Chemical offers low dielectric materials which are suitable for 5G communication, millimeter wave radar, and large-capacity high-speed substrates.
SLK series having excellent high frequency characteristics of over 10 GHz are materials for wafer coats for high frequency applications, interlayer insulations and low dielectric substrates.
Quartz fabric (SQX series) is a core material for low dielectric substrates and a substrate material of prepreg.

Details of product