Shin-Etsu Chemical Co.,Ltd. Organic Electronics Materials Dept.

Low dielectric material

SLK series

The SLK series has top-class low-dielectric and low-dielectric loss tangent as thermosetting resins.
In particular, SLK has excellent characteristics in the high frequency band such as millimeter waves, and SLK can be used for next-generation interlayer insulating films, copper-clad laminates (CCL), and flexible substrates (FCCL).
SLK has possible to design high-adhesion and low-warp coating materials by using it.


Grade Dk Df Thermal decomposition
Dielectric strength
10-80GHz 10-80GHz TGA kV/0.1mm
SLK series < 2.5 < 0.0025 > 400℃ > 10

* The data of each product that exists in the above-mentioned table is not a standard value. Please test without fail before use beforehand, and confirm whether to suit use.