Low dielectric material
SLK series
The SLK series has top-class low-dielectric and low-dielectric loss tangent as thermosetting resins.
In particular, SLK has excellent characteristics in the high frequency band such as millimeter waves, and SLK can be used for next-generation interlayer insulating films, copper-clad laminates (CCL), and flexible substrates (FCCL).
SLK has possible to design high-adhesion and low-warp coating materials by using it.
Properties
| Grade | Dk | Df | Thermal decomposition temperature |
Dielectric strength |
|---|---|---|---|---|
| 10-80GHz | 10-80GHz | TGA | kV/0.1mm | |
| SLK series | < 2.5 | < 0.0025 | > 400℃ | > 10 |
* The data of each product that exists in the above-mentioned table is not a standard value. Please test without fail before use beforehand, and confirm whether to suit use.