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  Semiconductor Materials

  Variety of packages appears and generates needs of multiple materials’ coordinate. Shin-Etsu provides “Total Solution”.

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  Thermal Conductive Materials

  Shin-Etsu provides variety thermal conductive material with good adhesion to many kinds of materials and long experience in Semiconductor materials market.

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  Automotive related materials

  Automobile industry is undergoing major changes. Shin-Etsu provide various materials to realize automated driving and motorized vehicles.

Epoxy molding compounds

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  Epoxy Molding Materials for Automotive application

  Shin-Etsu epoxy molding materials for automotive applications performs excellent high reliability under stringent conditions.

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  Epoxy Molding Materials for Power device

  Shin-Etsu epoxy molding materials for power device is superior material by good heat dissipation.

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  High heat resistance Encapsulating Materials

  Shin-Etsu epoxy molding materials is shown high heat resistance performance under high temperature.

Liquid epoxy encapsulating materials

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  Liquid encapsulating materials for capillary underfill

  Shin-Etsu capillary underfill material performs excellent crack resistance due to unique silicone technology in stress reduction and tough resin formulation.

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  Liquid encapsulating materials for 2^nd underfill

  Shin-Etsu 2^nd underfill material can cure at 100°C, suitable for adhering electronic parts (IC, resister and capacitor etc.) to printed board.

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  Liquid Epoxy Encapsulating Materials with Low Stress

  SMC-762 series shows high reliability performance with good oil, gasoline and chemical resistance.

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  High thermal stability liquid encapsulating materials

  Suitable for car device application

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  Liquid Encapsulating Materials for High power device

  Showing goods adhesion under high temperature (Tg : > 200°C)

Liquid epoxy encapsulating materials

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  Compression Molding (E-CAP^®)

  Making a Large panel or interposer without warpage

Optical device encapsulating materials

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  Silicone Material for Optical Semiconductor

  Silicone materials offers good adhesion, shape control and crack resistance due to excellent thermal and light stability.

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  Silicone Material for Optical Semiconductor

  Photocoupler application
  Compact Image Sensor application

LED encapsulating materials

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  Die attach adhesive for LED device

  Shin-Etsu Silicone die attach adhesive for LED offers non-yellowing for long time due to high thermal resistance.

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  LimpidSi Silicone for High power LED application

  Shin-Etsu Silicone Materials for LED are provided good reliability performance of high brightness LED after exposure harsh conditions.

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  Materials for LED device

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  Materials for LED device

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  Wavelength Conversion Film

  LPS-AF series are adhesive film materials that mix silicones with a fluorescent substance. By attaching it to LED chip surface, easily changing blue color light to various color lights.

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  Silicone Coating Material

  Shin-Etsu high purity electronic grade silicone resins are provided electrical protection of LED and semiconductor elements.

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  Silicone for Discrete Diode and Power Device

  Silicone contributes for improving the functional effect such as electric protection and humidity resistance, stress relaxation etc.

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  Thermal conductive materials

  Shin-Etsu Silicone thermal conductive materials offer good adhesion to many kind of materials under high temperature (150°C<).

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  Room Temperature Curable High Thermal Conductive Adhesive

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  Thermal Conductive Silicone Glue

  Good adhesion of Device to heat sinks improves reliability and stability of electronics device.

Silicone Optical Fiber Coating

Optical fiber coatings provide a protective coating for fine optical fibers to protect the surface while providing greater strength.

Wafer Level Die attach adhesive

Shin-Etsu offers a unique die attach material which is stencil printable material for semiconductor wafer.

Re-Distribution Layer (RDL) Materials

"SINR series" is photo sensitive RDL Materials for making Fan-Out wafer level package. Good photo patternable with low stress.