Shin-Etsu Chemical Co.,Ltd. Organic Electronics Materials Dept.

Epoxy molding material

KMC series

KMC series, Shin-Etsu Chemical's semiconductor encapsulation material, is an epoxy molding compound which is using by advanced technology through development of silicone, and is a transfer molding material for encapsulation of various electronic components.
KMC series are having excellent low stress and low warpage, as well as high heat resistance and high thermal conductivity.
Shin-Etsu supply highly reliable encapsulation materials not only for general semiconductors device but also for large in-vehicle power modules and various sensor applications.

Properties

LF(High reliability)

Grade Application L/F type MSL Properties AEC
Q100
Molding
Condition
Postcure
Condition
Spiral
flow
Tg Flexural
modulus
Water absorption
85°C/85%RH 168hr.
cm °C Mpa %
KMC-
3000-1
QFP
SOP
QFN
Cu
Ag plating
PPF
level
1~3
*1
110 130 150 0.18 Grade 0
*1
175°C
90sec
180°C
4hr
*1 Depend on package size,lead frame material

High thermal stability,High breakdown voltage

Grade Application Properties
Tracking
resistant
Spiral
flow
Tg CTE1 Flexural
modulus
Flexural
strength
Volume
resistivity
150°C
V cm °C ppm/°C Mpa GPa Ω・cm
KMC-2285C SMC Package
DBC Substrate modules
> 600 100 155 11 145 24 2.7x1014
KMC-2290-8A SMC Package
DBC Substrate modules
> 600 125 150 9 150 21 2.0x1014
KMC-2300 SMC Package
DBC Substrate modules
> 600 90 200 10 130 17 2.5x1014
KMC-2310 TO
Cu Substrate modules
> 600 125 200 15 130 13 2.5x1014
KMC-5020 TO
Cu Substrate modules
525 85 260 14 150 16 1x1015
Grade AEC Q100 Max. Junction Temperature
(Tjmax.)
Molding Condition Postcure Condition
KMC-2285C Grade 0 Apply
 *1
175°C 175°C
120sec
180°C
4hr
KMC-2290-8A Grade 0 Apply
 *1
175°C 175°C
120sec
180°C
4hr
KMC-2300 Grade 0 Apply
 *1
175°C 175°C
120sec
180°C
4hr
KMC-2310 Grade 0 Apply
 *1
175°C 175°C
120sec
180°C
4hr
KMC-5020 Grade 0 Apply
*1
250°C 175°C
120sec
220°C
4hr
*1 Depend on package size,lead frame material

High thermal Conductive

Grade Properties Molding Condition Postcure Condition
Thermal Conductivity Spiral flow Tg CTE1 Flexural modulus Flexural strength
W/mK cm °C ppm/°C Mpa GPa
KMC-4885F 4 100 130 11 155 48 175°C
180sec
180°C
4hr

High functionality WLP

Grade Properties Molding
Condition
Postcure
Condition
Dielectric
Constant
10GHz
Dissipation
factor
10GHz
Flexural
strength
Tensile
strength
Tensile
modulus
Elongation Tg CTE
Tg under
Mpa Mpa Mpa °C ppm/°C
X-43-2940 2.9 0.0014 330 16 260 42 60 80 175°C
180sec
180°C
2hr

LowDkDf

Grade Properties Molding
Condition
Postcure
Condition
Dielectric
Constant
10GHz
Dissipation
factor
10GHz
Flexural
strength
Tensile
strength
Tensile
modulus
Elongation Tg CTE
Tg under
Mpa Mpa Mpa °C ppm/°C
X-43-2945 2.9 0.0009 380 16 260 42 60 80 175°C
180sec
180°C
2hr

Plating Applicable

Grade Properties Molding Condition Postcure Condition
Spiral flow Tg Flexural modulus Flexural strength
cm °C Mpa GPa
KMC-9220 250 110 150 20 175°C
180sec
180°C
4hr

* The data of each product that exists in the above-mentioned table is not a standard value. Please test without fail before use beforehand, and confirm whether to suit use.