KMC series

KMC series, Shin-Etsu Chemical's semiconductor encapsulation material, is an epoxy molding compound which is using by advanced technology through development of silicone, and is a transfer molding material for encapsulation of various electronic components.
KMC series are having excellent low stress and low warpage, as well as high heat resistance and high thermal conductivity.
Shin-Etsu supply highly reliable encapsulation materials not only for general semiconductors device but also for large in-vehicle power modules and various sensor applications.

Properties

LF（High reliability）

Grade	Application	L/F type	MSL	Properties				AEC Q100	Molding Condition	Postcure Condition
				Spiral flow	Tg	Flexural modulus	Water absorption 85°C/85％RH 168hr.
				cm	°C	MPa	%
KMC- 3000-1	QFP SOP QFN	Cu Ag plating PPF	level 1～3 ＊1	110	130	150	0.18	Grade 0 ＊1	175°C 90sec	180°C 4hr
＊1　Depend on package size,lead frame material

High thermal stability,High breakdown voltage

Grade	Application	Properties
		Tracking resistant	Spiral flow	Tg	CTE1	Flexural modulus	Flexural strength	Volume resistivity 150°C
		V	cm	°C	ppm/°C	MPa	GPa	Ω・cm
KMC-2285C	SMC Package DBC Substrate modules	> 600	100	155	11	145	24	2.7ｘ1014
KMC-2290-8A	SMC Package DBC Substrate modules	> 600	125	150	9	150	21	2.0ｘ1014
KMC-2300	SMC Package DBC Substrate modules	> 600	90	200	10	130	17	2.5ｘ1014
KMC-2310	TO Cu Substrate modules	> 600	125	200	15	130	13	2.5ｘ1014
KMC-5020	TO Cu Substrate modules	525	85	260	14	150	16	1ｘ1015

Grade	AEC Q100	Max. Junction Temperature （Tjmax.)	Molding Condition	Postcure Condition
KMC-2285C	Grade 0 Apply 　＊1	175°C	175°C 120sec	180°C 4hr
KMC-2290-8A	Grade 0 Apply 　＊1	175°C	175°C 120sec	180°C 4hr
KMC-2300	Grade 0 Apply 　＊1	175°C	175°C 120sec	180°C 4hr
KMC-2310	Grade 0 Apply 　＊1	175°C	175°C 120sec	180°C 4hr
KMC-5020	Grade 0 Apply ＊1	250°C	175°C 120sec	220°C 4hr
＊1　Depend on package size,lead frame material

High thermal Conductive

Grade	Properties						Molding Condition	Postcure Condition
	Thermal Conductivity	Spiral flow	Tg	CTE1	Flexural modulus	Flexural strength
	W/mK	cm	°C	ppm/°C	MPa	GPa
KMC-4885F	4	100	130	11	155	48	175°C 180sec	180°C 4hr

High functionality WLP

Grade	Properties								Molding Condition	Postcure Condition
	Dielectric Constant 10GHｚ	Dissipation factor 10GHｚ	Flexural strength	Tensile strength	Tensile modulus	Elongation	Tg	CTE Tg under
			MPa	MPa	MPa	％	°C	ppm/°C
X-43-2940	2.9	0.0014	330	16	260	42	60	80	175°C 180sec	180°C 2hr

LowDkDf

Grade	Properties								Molding Condition	Postcure Condition
	Dielectric Constant 10GHｚ	Dissipation factor 10GHｚ	Flexural strength	Tensile strength	Tensile modulus	Elongation	Tg	CTE Tg under
			MPa	MPa	MPa	％	°C	ppm/°C
X-43-2945	2.9	0.0009	380	16	260	42	60	80	175°C 180sec	180°C 2hr

Plating Applicable

Grade	Properties				Molding Condition	Postcure Condition
	Spiral flow	Tg	Flexural strength	Flexural modulus
	cm	°C	MPa	GPa
KMC-9220	250	110	150	20	175°C 180sec	180°C 4hr