Die Attach Material
Shin-Etsu die attach materials are two types, epoxy and silicone type. Epoxy based B stage material is a high purity insulating die attach material developed for stencil or screen printing. Showing good performance releasability, shape retention, storage stability at B stage status(semi-cured status with no tack appearance). After chip bonding, it can be re-melted by heating at high temperature and treat like thermal curing. It shows high low stress after curing.
Properties
B-Stage Epoxy Die attach
| Product | Appearance | Melt viscosity | Tg | Young Modulus | Condition of B-Stage |
Potlife after B-Stage |
Chip Boarding Condition | Cure Condition | |
|---|---|---|---|---|---|---|---|---|---|
| Unit | Pa･s | °C | MPa | ||||||
| SFX513S | Black | 120 | 36 | 390 | 120°C/10min | Room temp. / 6 month |
150 °C (Chip), 150°C (Substrate) |
0.5sec | Raising Temperature at 30min / 125°C →125°C×1～2hr |
| Product | CTE1(25ppm/°C） | CTE1(25ppm/°C） | TG |
|---|---|---|---|
| SFX-530D | 25 | 80 | 230 |
| SFX-540D | 20 | 70 | 230 |
Silicone die Attach
| Product | Feature | Cure Condition | Melt viscosity | Refractive index | Hardness |
|---|---|---|---|---|---|
| °C | Pa.s | ND25 | |||
| LPS-8448X | LED, Optical Sensor | 150 | 23 | 1.41 | D60 |
| LPS-8420 | Optical Sensor | 21 | 1.41 | A70 | |
| LPS-8421 | Optical Sensor | 30 | 1.41 | A40 |
* The data of each product that exists in the above-mentioned table is not a standard value. Please test without fail before use beforehand, and confirm whether to suit use.