Shin-Etsu Chemical Co.,Ltd. Organic Electronics Materials Dept.

Epoxy Encapsulant Material

KMC series

Shin-Etsu Chemical semiconductor encapsulation materials are epoxy based materials by using transfer molding system for various electronic parts. It is developed with the advanced technology cultivated through the development of silicone. It has excellent low stress, low warpage and high thermal conductivity.

Shin-Etsu supplies not only general surface mount device but also highly reliable encapsulation materials for large automotive power modules and various sensors.

Properties

Lead Flame Package

Product Application Sprialflow Melt
viscosity
Tg CTEα1 Flexural
modulus
cm Pa*s °C ppm GPa
KMC-3210GF QFN, LQFP 170 4 125 10 23
KMC-300 TSOP, LQFP 130 7 125 11 20
KMC-3580HB HLQFP, HTSOP 75 15 135 10 18
KMC-2110G-7 DPAK, TO, SOIC 120 8 135 13 19

High Tg, High thermal stability, High breakdown voltage

Product Feature Sprialflow Melt
viscosity
Tg CTEα1 Flexural
modulus
cm Pa*s °C ppm GPa
KMC-2280 High Tg, α=15ppm 100 9 190 15 12
KMC-2285 High Tg, α=10ppm 90 20 175 10 18
KMC-3600 High thermal stability Epoxy 110 8 175 15 12
KMC-8800 High thermal stability Resin 120 8 225 14 14
KMC-5000G Higher Tg 120 6 300 11 18
KMC-2285C CTI>600V 100 14 155 10 24

High thermal Conductive

Product Feature Sprialflow Melt
viscosity
Tg CTEα1 Flexural
modulus
Thermal
conductivity
cm Pa*s °C ppm GPa W
KMC-4800FLV High thermal Conductive 54 30 160 12 26 3
KMC-4885F2 High thermal Conductive 71 50 130 13 45 5

* The data of each product that exists in the above-mentioned table is not a standard value. Please test without fail before use beforehand, and confirm whether to suit use.