Epoxy Encapsulant Material
KMC series
Shin-Etsu Chemical semiconductor encapsulation materials are epoxy based materials by using transfer molding system for various electronic parts. It is developed with the advanced technology cultivated through the development of silicone. It has excellent low stress, low warpage and high thermal conductivity.
Shin-Etsu supplies not only general surface mount device but also highly reliable encapsulation materials for large automotive power modules and various sensors.
Properties
Lead Flame Package
Product | Application | Sprialflow | Melt viscosity |
Tg | CTEα1 | Flexural modulus |
---|---|---|---|---|---|---|
cm | Pa*s | °C | ppm | GPa | ||
KMC-3210GF | QFN, LQFP | 170 | 4 | 125 | 10 | 23 |
KMC-300 | TSOP, LQFP | 130 | 7 | 125 | 11 | 20 |
KMC-3580HB | HLQFP, HTSOP | 75 | 15 | 135 | 10 | 18 |
KMC-2110G-7 | DPAK, TO, SOIC | 120 | 8 | 135 | 13 | 19 |
High Tg, High thermal stability, High breakdown voltage
Product | Feature | Sprialflow | Melt viscosity |
Tg | CTEα1 | Flexural modulus |
---|---|---|---|---|---|---|
cm | Pa*s | °C | ppm | GPa | ||
KMC-2280 | High Tg, α=15ppm | 100 | 9 | 190 | 15 | 12 |
KMC-2285 | High Tg, α=10ppm | 90 | 20 | 175 | 10 | 18 |
KMC-3600 | High thermal stability Epoxy | 110 | 8 | 175 | 15 | 12 |
KMC-8800 | High thermal stability Resin | 120 | 8 | 225 | 14 | 14 |
KMC-5000G | Higher Tg | 120 | 6 | 300 | 11 | 18 |
KMC-2285C | CTI>600V | 100 | 14 | 155 | 10 | 24 |
High thermal Conductive
Product | Feature | Sprialflow | Melt viscosity |
Tg | CTEα1 | Flexural modulus |
Thermal conductivity |
---|---|---|---|---|---|---|---|
cm | Pa*s | °C | ppm | GPa | W | ||
KMC-4800FLV | High thermal Conductive | 54 | 30 | 160 | 12 | 26 | 3 |
KMC-4885F2 | High thermal Conductive | 71 | 50 | 130 | 13 | 45 | 5 |
* The data of each product that exists in the above-mentioned table is not a standard value. Please test without fail before use beforehand, and confirm whether to suit use.