Variety of packages appears and generates needs of multiple materials’ coordinate. Shin-Etsu provides “Total Solution”.
Shin-Etsu provides variety thermal conductive material with good adhesion to many kinds of materials and long experience in Semiconductor materials market.
Automobile industry is undergoing major changes. Shin-Etsu provide various materials to realize automated driving and motorized vehicles.
Shin-Etsu epoxy molding materials for automotive applications performs excellent high reliability under stringent conditions.
Shin-Etsu epoxy molding materials for power device is superior material by good heat dissipation.
Shin-Etsu epoxy molding materials is shown high heat resistance performance under high temperature.
Shin-Etsu capillary underfill material performs excellent crack resistance due to unique silicone technology in stress reduction and tough resin formulation.
Shin-Etsu 2nd underfill material can cure at 100°C, suitable for adhering electronic parts (IC, resister and capacitor etc.) to printed board.
SMC-762 series shows high reliability performance with good oil, gasoline and chemical resistance.
Suitable for car device application
Showing goods adhesion under high temperature (Tg : > 200°C)
Making a Large panel or interposer without warpage
Silicone materials offers good adhesion, shape control and crack resistance due to excellent thermal and light stability.
Photocoupler applicationCompact Image Sensor application
Shin-Etsu Silicone die attach adhesive for LED offers non-yellowing for long time due to high thermal resistance.
Shin-Etsu Silicone Materials for LED are provided good reliability performance of high brightness LED after exposure harsh conditions.
LPS-AF series are adhesive film materials that mix silicones with a fluorescent substance. By attaching it to LED chip surface, easily changing blue color light to various color lights.
Shin-Etsu high purity electronic grade silicone resins are provided electrical protection of LED and semiconductor elements.
Silicone contributes for improving the functional effect such as electric protection and humidity resistance, stress relaxation etc.
Shin-Etsu Silicone thermal conductive materials offer good adhesion to many kind of materials under high temperature (150°C<).
Good adhesion of Device to heat sinks improves reliability and stability of electronics device.
Optical fiber coatings provide a protective coating for fine optical fibers to protect the surface while providing greater strength.
Shin-Etsu offers a unique die attach material which is stencil printable material for semiconductor wafer.
"SINR series" is photo sensitive RDL Materials for making Fan-Out wafer level package. Good photo patternable with low stress.
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