信越化学工業株式会社 有機材料部

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Support High Technology of Semiconductor element with Shin-Etsu's Encapsulation Materials
ProductsCatalogContact Us
  • Epoxy Molding Compounds (KMC series)
  • Encapsulating Material for LED (LPS series)
  • Liquid Epoxy Encapsulating Materials (SMC series)
  • Junction Coating Resins (KJR series)
  • ilicone Encapsulating Materials (SGC series)
  • Die Attach Materials (SFX series)
What's New
Back Number
2016.02.17
We exhibited at LIGHTING JAPAN2016 -8th LIGHT TECH-EXPO -.
2015.11.24
We plan to exhibit at LIGHTING JAPAN2016 -8th LIGHT TECH-EXPO -
2015.06.30
The following leaflets are added.
1.High heat resistance Encapsulating Materials
2.Liquid Encapsulating Materials for High power device
3.Compression Molding (E-CAP®)
4.Wavelength Conversion Film
5.Silicone for Discrete Diode and Power Device
6.Thermal Conductive Silicone Glue
7.Re-Distribution Layer (RDL) Materials
2015.02.03
We exhibited at LIGHTING JAPAN2015.
2014.10.28
The leaflets of ”Liquid epoxy encapsulating materials” are added.
2014.10.28
We exhibited at LED Next Stage 2014.
The Manufacture of Shin-Etsu Encapsulation materials is based on the following registered international quality and environmental management standards.

Gunma Complex ISO 9001  ISO 14001
(JCQA-0004  JCQA-E-0002)
Naoetsu Plant ISO 9001  ISO 140001
(JCQA-0018  JCQA-E-0064)
Green EMCHigh Toughness Epoxy compoundLEDLiquid epoxy encapsulating MaterialsSilicone Packaging Materials for diode
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