We exhibited at LIGHTING JAPAN2016 －8
LIGHT TECH-EXPO －.
We plan to exhibit at LIGHTING JAPAN2016 －8th LIGHT TECH-EXPO －
The following leaflets are added.
1．High heat resistance Encapsulating Materials
2．Liquid Encapsulating Materials for High power device
3．Compression Molding (E-CAP®)
4．Wavelength Conversion Film
5．Silicone for Discrete Diode and Power Device
6．Thermal Conductive Silicone Glue
7．Re-Distribution Layer (RDL) Materials
We exhibited at LIGHTING JAPAN2015.
The leaflets of ”Liquid epoxy encapsulating materials” are added.
We exhibited at LED Next Stage 2014.
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