We plan to exhibit at AUTOMOTIVE ENGINEERING EXPOSITION 2016 NAGOYA.
Please click here due to pre-registration.
We exhibited at LIGHTING JAPAN2016 －8
LIGHT TECH-EXPO －.
The following leaflets are added.
1．High heat resistance Encapsulating Materials
2．Liquid Encapsulating Materials for High power device
3．Compression Molding (E-CAP®)
4．Wavelength Conversion Film
5．Silicone for Discrete Diode and Power Device
6．Thermal Conductive Silicone Glue
7．Re-Distribution Layer (RDL) Materials
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