信越化学工業株式会社 有機材料部

JapaneseEnglishChinese
Loading
Support High Technology of Semiconductor element with Shin-Etsu's Encapsulation Materials
ProductsCatalogContact Us
  • Epoxy Molding Compounds (KMC series)
  • Encapsulating Material for LED (LPS series)
  • Liquid Epoxy Encapsulating Materials (SMC series)
  • Junction Coating Resins (KJR series)
  • ilicone Encapsulating Materials (SGC series)
  • Die Attach Materials (SFX series)
What's New
2016.06.06
We plan to exhibit at AUTOMOTIVE ENGINEERING EXPOSITION 2016 NAGOYA.
Please click here due to pre-registration.
2016.02.17
We exhibited at LIGHTING JAPAN2016 -8th LIGHT TECH-EXPO -.
2015.06.30
The following leaflets are added.
1.High heat resistance Encapsulating Materials
2.Liquid Encapsulating Materials for High power device
3.Compression Molding (E-CAP®)
4.Wavelength Conversion Film
5.Silicone for Discrete Diode and Power Device
6.Thermal Conductive Silicone Glue
7.Re-Distribution Layer (RDL) Materials
Back Number
The Manufacture of Shin-Etsu Encapsulation materials is based on the following registered international quality and environmental management standards.

Gunma Complex ISO 9001  ISO 14001
(JCQA-0004  JCQA-E-0002)
Naoetsu Plant ISO 9001  ISO 140001
(JCQA-0018  JCQA-E-0064)
Green EMCHigh Toughness Epoxy compoundLEDLiquid epoxy encapsulating MaterialsSilicone Packaging Materials for diode
sitemapGo to ShinEtsu Web SiteShin-Etsu Group Materials Guide
Copyright © 2002-2015 Shin-Etsu Chemical Co., Ltd. All rights reserved.