Shin-Etsu Chemical Co.,Ltd :: Organic Electronics Materials Dept.

Support High Technology of Semiconductor element with Shin-Etsu's Encapsulation Materials
ProductsCatalogContact Us
  • Epoxy Molding Compounds (KMC series)
  • Encapsulating Material for LED (LPS series)
  • Liquid Epoxy Encapsulating Materials (SMC series)
  • Junction Coating Resins (KJR series)
  • ilicone Encapsulating Materials (SGC series)
  • Die Attach Materials (SFX series)
What's New
We plan to exhibit at AUTOMOTIVE WORLD 2018 -10th CAR-ELE JAPAN -
Booth #E40-31
Shin-Etsu Magnetics Europe GmbH of the contact page is renewed
We exhibited at AUTOMOTIVE WORLD 2017 -9th CAR-ELE JAPAN -.
Europe of the contact page is renewed.
We exhibited at LIGHTING JAPAN2016 -8th LIGHT TECH-EXPO -.
The following leaflets are added.
1.High heat resistance Encapsulating Materials
2.Liquid Encapsulating Materials for High power device
3.Compression Molding (E-CAP®)
4.Wavelength Conversion Film
5.Silicone for Discrete Diode and Power Device
6.Thermal Conductive Silicone Glue
7.Re-Distribution Layer (RDL) Materials
Back Number
The Manufacture of Shin-Etsu Encapsulation materials is based on the following registered international quality and environmental management standards.

Gunma Complex ISO 9001  ISO 14001
(JCQA-0004  JCQA-E-0002)
Naoetsu Plant ISO 9001  ISO 140001
(JCQA-0018  JCQA-E-0064)
Green EMCHigh Toughness Epoxy compoundLEDLiquid epoxy encapsulating MaterialsSilicone Packaging Materials for diode
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