信越化学工業株式会社 有機材料部

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Support High Technology of Semiconductor element with Shin-Etsu's Encapsulation Materials
ProductsCatalogContact Us
  • Epoxy Molding Compounds (KMC series)
  • Encapsulating Material for LED (LPS series)
  • Liquid Epoxy Encapsulating Materials (SMC series)
  • Junction Coating Resins (KJR series)
  • ilicone Encapsulating Materials (SGC series)
  • Die Attach Materials (SFX series)
What's New
2016.12.01
We made an announcement on November 17, 2016, we made an error in our booth number because we posted "9th International Car Electronics Technology Exhibition", we apologize for correction.
** Correction details **
"Booth No. A-222" → "Booth No. E 38 - 28"
2016.11.17
We plan to exhibit at AUTOMOTIVE WORLD 2017 -9th CAR-ELE JAPAN -.
AUTOMOTIVE WORLD 2017 -9th CAR-ELE JAPAN - 
2016.11.17
We exhibited at AUTOMOTIVE ENGINEERING EXPOSION NAGOYA2016.
2016.02.17
We exhibited at LIGHTING JAPAN2016 -8th LIGHT TECH-EXPO -.
2015.06.30
The following leaflets are added.
1.High heat resistance Encapsulating Materials
2.Liquid Encapsulating Materials for High power device
3.Compression Molding (E-CAP®)
4.Wavelength Conversion Film
5.Silicone for Discrete Diode and Power Device
6.Thermal Conductive Silicone Glue
7.Re-Distribution Layer (RDL) Materials
Back Number
The Manufacture of Shin-Etsu Encapsulation materials is based on the following registered international quality and environmental management standards.

Gunma Complex ISO 9001  ISO 14001
(JCQA-0004  JCQA-E-0002)
Naoetsu Plant ISO 9001  ISO 140001
(JCQA-0018  JCQA-E-0064)
Green EMCHigh Toughness Epoxy compoundLEDLiquid epoxy encapsulating MaterialsSilicone Packaging Materials for diode
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