Liquid Epoxy Encapsulant Material
Shin-Etsu Chemical liquid epoxy encapsulating material (SMC series) is a one component type liquid epoxy materials which developed on the basis of semiconductor devices for especially underfill applications.
Semiconductor devices molded by "SMC" have excellent electrical characteristics and moisture resistance. In addition, it is shown outstanding function on stress reduction by using specific technique of silicone.
Properties
Capillary Underfill
Product | Filler cut size |
Melt viscosity |
Tg | CTEα1 | Flexural modulus |
---|---|---|---|---|---|
μm | Pa*s | °C | ppm | GPa | |
SMC-377S | 10 | 30 | 100 | 35 | 8 |
SMC-3700UF | 5 | 14 | 120 | 27 | 8 |
SMC-375TGSF5 | 1 | 9 | 115 | 35 | 7 |
SMC-375TGSF11 | 1 | 25 | 115 | 28 | 8 |
Board Level Underfill
Product | Filler cut size |
Melt viscosity |
Tg | CTEα1 | Flexural modulus |
---|---|---|---|---|---|
μm | Pa*s | °C | ppm | GPa | |
SMC-365SDL | 24 | 3 | 130 | 30 | 7 |
SMC-365SDL-4 | 24 | 5 | 140 | 26 | 8 |
High thermal Conductive Underfill
Product | Filler cut size |
Melt viscosity |
Tg | CTEα1 | Flexural modulus |
Thermal conductivity |
---|---|---|---|---|---|---|
μm | Pa*s | °C | ppm | GPa | W/mK | |
X-43-5881AL | 3 | 46 | 113 | 29 | 9 | 2 |
Dam & Potting
Product | Feature | Sprialflow | Melt viscosity |
Tg | CTEα1 | Flexural modulus |
---|---|---|---|---|---|---|
cm | Pa*s | °C | ppm | GPa | ||
SMC-762DT | Dam | 53 | 100 | 145 | 12 | 16 |
SMC-762NN | Potting | 53 | 25 | 135 | 13 | 15 |
Potting for Power device Module
Product | Melt viscosity |
Tg | CTEα1 | Flexural modulus |
Breakdown Voltage |
---|---|---|---|---|---|
Pa*s | °C | ppm | GPa | kV/mm | |
SMC-8750L | 110 | 150 | 18 | 10 | 30 |
SMC-8750L2 | 700 | 150 | 11 | 20 | 30 |
SMC-8750K7 | 65 | 220 | 19 | 12 | 33 |
SMC-8750X2 | 500 | 180 | 11 | 20 | 30 |
* The data of each product that exists in the above-mentioned table is not a standard value. Please test without fail before use beforehand, and confirm whether to suit use.