Shin-Etsu Chemical Co.,Ltd. Organic Electronics Materials Dept.

Liquid Epoxy Encapsulant Material

Shin-Etsu Chemical liquid epoxy encapsulating material (SMC series) is a one component type liquid epoxy materials which developed on the basis of semiconductor devices for especially underfill applications.
Semiconductor devices molded by "SMC" have excellent electrical characteristics and moisture resistance. In addition, it is shown outstanding function on stress reduction by using specific technique of silicone.

Properties

Capillary Underfill

Product Filler
cut size
Melt
viscosity
Tg CTEα1 Flexural
modulus
μm Pa*s °C ppm GPa
SMC-377S 10 30 100 35 8
SMC-3700UF 5 14 120 27 8
SMC-375TGSF5 1 9 115 35 7
SMC-375TGSF11 1 25 115 28 8

Board Level Underfill

Product Filler
cut size
Melt
viscosity
Tg CTEα1 Flexural
modulus
μm Pa*s °C ppm GPa
SMC-365SDL 24 3 130 30 7
SMC-365SDL-4 24 5 140 26 8

High thermal Conductive Underfill

Product Filler
cut size
Melt
viscosity
Tg CTEα1 Flexural
modulus
Thermal
conductivity
μm Pa*s °C ppm GPa W/mK
X-43-5881AL 3 46 113 29 9 2

Dam & Potting

Product Feature Sprialflow Melt
viscosity
Tg CTEα1 Flexural
modulus
cm Pa*s °C ppm GPa
SMC-762DT Dam 53 100 145 12 16
SMC-762NN Potting 53 25 135 13 15

Potting for Power device Module

Product Melt
viscosity
Tg CTEα1 Flexural
modulus
Breakdown
Voltage
Pa*s °C ppm GPa kV/mm
SMC-8750L 110 150 18 10 30
SMC-8750L2 700 150 11 20 30
SMC-8750K7 65 220 19 12 33
SMC-8750X2 500 180 11 20 30

* The data of each product that exists in the above-mentioned table is not a standard value. Please test without fail before use beforehand, and confirm whether to suit use.