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Die attach materials
B stage Material
| General properties | Appearance | Viscosity | Glass Transition temperature | Young’s modulus | B Staging condition | B stage life (after B staging before die mounting) | Die mounting condition | Cure condition | |
|---|---|---|---|---|---|---|---|---|---|
| Unit | Pa･s | ºC | MPa | ||||||
| SFX513S | Black |
120 | 36 | 390 | 120 ºC/10min |
Room temp./ 6 month |
150 ºC（Chip）, 150ºC（Substrate） | 0.5sec | Ramp Up 30 min. to 125 ºC → 125ºC ×1～2hr. |
