Shin-Etsu Chemical Co.,Ltd :: Organic Electronics Materials Dept. ::

Liquid epoxy encapsulating materials

Firstly-Underfill

Product Name	Feature	Filler Size (Max.)	Viscosity	Tg	CTE1	CTE2	Modulus	Substrate Temp.	Cure Condition	Storage Condition	Shelfelife
Unit	Feature	µm	Pa・s	ºC	ppm/ºC	ppm/ºC	MPa	ºC	ºC/2h		Month
SMC- 377SA	Low-k/Low Warpage for FCBGA	10	30	100	35	95	8000	120	165	Under -40ºC	8
SMC- 375XX	Pb Free for FCBGA	10	30	135	30	86	8000
SMC- 375XF4B	Narrow Gape Type	5	8	145	54	134	4200
SMC- 376X8	For Over Mold	10	60	140	27	67	12000

Secondaly-Underfill

Product Name	Feature	Filler Size (Max.)	Viscosity	Gelation Time	Tg	CTE1	CTE2	Modulus	Substrate Temp.	Cure Condition	Storage Condition	Shelfelife
Unit	Feature	µm	Pa・s	s/150ºC	ºC	ppm/ºC	ppm/ºC	MPa	ºC	ºC/2h		Month
SMC- 365SD-1	Good Capillarity	10	13	110	135	38	110	6500	120	150	Under -40ºC	6
SMC- 375-1F	Good Adhesion	10	15	-	150	35	105	6000	120	165		8
SMC- 184A	for Re-Work	45	17	-	86(DMA)	47	155	3900	100	100ºC/0.5h		8

Potting

Product Name	Feature	Viscosity	Gelation Time	Tg	CTE1	CTE2	Modulus	Substrate Temp.	Cure Condition	Storage Condition	Shelfelife
Unit	Feature	Pa・s	s/150ºC	ºC	ppm/ºC	ppm/ºC	MPa	ºC	ºC/2h		Month
LMC-22	Flow Type	35	60	155	17	60	12000	80	150	Under -20ºC	6

Glob-Top & Cob

Product Name	Feature	Viscosity	Aspect Ratio	Gelation Time	Tg	CTE1	CTE2	Modulus	Substrate Temp.	Cure Condition	Storage Condition	Shelfelife
Unit	Feature	Pa・s	/120ºC	s/150ºC	ºC	ppm/ºC	ppm/ºC	MPa	ºC	ºC/2h		Month
SMC-868	Thixotrophic Type	70	0.3	65	150	14	51	13500	60`80	150	Under -20ºC	6

Dam

Product Name	Feature	Viscosity	Aspect Ratio	Gelation Time	Tg	CTE1	CTE2	Modulus	Substrate Temp.	Cure Condition	Storage Condition	Shelfelife
Unit	Feature	Pa・s	/120ºC	s/150ºC	ºC	ppm/ºC	ppm/ºC	MPa	ºC	ºC/2h		Month
X-43 -5255	Good Shape Retention	700	0.7	70	140	25	95	8000	R.T.	150	Under -20ºC	6