Epoxy molding compoundsEpoxy molding compounds

Discreate

General properties Feature Spiral flow Specific gravity Glass transition temp. CTE
α1		 Flexural strength Flexural modulus Thermal conductivity
Unit cm - ºC ppm/ºC N/mm² N/mm² W/mK
KMC-103
Standard
80 1.81 170 20 140 13,000 0.6
KMC-130
Good humidity resistance
 50 1.80 160 19 140 14,000 0.6
KMC-120MK High thermal conductivity
(Full-pack,APowder-transistor)		 50 2.25 165 20 150 23,000 2.5
KMC-125 65 2.20 165 20 155 21,000 2.3
KMC-520 60 2.25 150 21 150 22,000 2.1

SMD Package

General properties Application Spiral flow Specific gravity Glass transition temp. CTE
α1		 CTE
α2		 Flexural strength Flexural modulus
Unit cm - ºC ppm/ºC ppm/ºC N/mm² N/mm²
KMC-180
LQFP, TQFP, QFP, TSOP, TSSOP, SOP
 80 1.89 160 13 57 120 13,000
KMC-184 90 1.89 160 13 57 120 13,000
KMC-188 90 1.89 165 13 57 120 13,000
KMC-289 90 1.94 140 11 45 140 19,000

Green EMC

General properties Application Spiral flow Specific gravity Glass transition temp. CTE
α1		 CTE
α2		 Flexural strength Flexural modulus
Unit cm - ºC ppm/ºC ppm/ºC N/mm² N/mm²
KMC-3800
LQFP, TQFP, QFP, TSOP, TSSOP
 90 2.00 130 9 32 150 22,000
KMC-300 160 1.99 130 11 45 150 22,000
KMC-3510 85 1.98 140 9 40 150 21,000
KMC-284
CSP, BGA, MCP
 110 2.01 130 9 35 150 25,000
KMC-3580 150 1.98 130 11 45 150 21,000
KMC-6000 100 2.00 145 8 34 140 22,000

BGA Package

General properties Application Spiral flow Specific gravity Glass transition temp. CTE
α1		 CTE
α2		 Flexural strength Flexural modulus
Unit cm - ºC ppm/ºC ppm/ºC N/mm² N/mm²
KMC-211
CSP, BGA, MCP
 115 1.98 185 11 42 130 19,000
KMC-218
CSP, QFN
 95 1.94 180 13 38 130 18,000
Discreate SMD Package Green EMC BGA Package