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Encapsulation materials for semiconductor devices

Encapsulation materials for semiconductor devices

Epoxy molding compounds

Discreate

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General properties	Feature	Spiral flow	Specific gravity	Glass transition temp.	CTE α1	Flexural strength	Flexural modulus	Thermal conductivity
Unit	Feature	cm	-	ºC	ppm/ºC	N/mm²	N/mm²	W/mK
KMC-103	Standard	80	1.81	170	20	140	13,000	0.6
KMC-130	Good humidity resistance	50	1.80	160	19	140	14,000	0.6
KMC-120MK	High thermal conductivity (Full-pack,APowder-transistor)	50	2.25	165	20	150	23,000	2.5
KMC-125		65	2.20	165	20	155	21,000	2.3
KMC-520		60	2.25	150	21	150	22,000	2.1

SMD Package

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General properties	Application	Spiral flow	Specific gravity	Glass transition temp.	CTE α1	CTE α2	Flexural strength	Flexural modulus
Unit	Application	cm	-	ºC	ppm/ºC	ppm/ºC	N/mm²	N/mm²
KMC-180	LQFP, TQFP, QFP, TSOP, TSSOP, SOP	80	1.89	160	13	57	120	13,000
KMC-184		90	1.89	160	13	57	120	13,000
KMC-188		90	1.89	165	13	57	120	13,000
KMC-289		90	1.94	140	11	45	140	19,000

Green EMC

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General properties	Application	Spiral flow	Specific gravity	Glass transition temp.	CTE α1	CTE α2	Flexural strength	Flexural modulus
Unit	Application	cm	-	ºC	ppm/ºC	ppm/ºC	N/mm²	N/mm²
KMC-3800	LQFP, TQFP, QFP, TSOP, TSSOP	90	2.00	130	9	32	150	22,000
KMC-300		160	1.99	130	11	45	150	22,000
KMC-3510		85	1.98	140	9	40	150	21,000
KMC-284	CSP, BGA, MCP	110	2.01	130	9	35	150	25,000
KMC-3580		150	1.98	130	11	45	150	21,000
KMC-6000		100	2.00	145	8	34	140	22,000

BGA Package

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General properties	Application	Spiral flow	Specific gravity	Glass transition temp.	CTE α1	CTE α2	Flexural strength	Flexural modulus
Unit	Application	cm	-	ºC	ppm/ºC	ppm/ºC	N/mm²	N/mm²
KMC-211	CSP, BGA, MCP	115	1.98	185	11	42	130	19,000
KMC-218	CSP, QFN	95	1.94	180	13	38	130	18,000