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Encapsulation materials for semiconductor devices
Epoxy molding compounds
Epoxy molding compounds
KMC series
Shin-Etsu is developing advanced packaging materials for encapsulating all types of semiconductor devices. This broad line of products offers low stress, very low warpage, and high thermal conductivity. Shin-Etsu has introduced a "green" halogen and antimony trioxide-free EMC that contributes to environmental conservation.
Liquid epoxy encapsulating materials
Liquid epoxy encapsulating materials
SMC series
Shin-Etsu liquid epoxy encapsulating materials for semiconductor devices performs excellent crack resistance due to silicone technology in stress reduction. Shin-Etsu can provide a variety of materials to meet various requirements of advanced packages.
